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2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

Dongguan Xinpei Plastic & Metal Electronic Co. Ltd
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Dongguan Xinpei Plastic & Metal Electronic Co. Ltd
City: Dongguan
Province/State: Guangdong
Country/Region: China
Contact Person:Mr Ricky Zou

2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

Brand Name : HRT
Model Number : A2001-T
Certification : ISO9001/ ISO14001/UL/RoHS/REACH
Place of Origin : dongguan, China(mainland)
MOQ : 100K PCS
Price : Negotiated
Payment Terms : TT, Western Union, PayPal, L/C
Supply Ability : 100 million pcs per month
Delivery Time : 5 to 8 working days after payment checked
Packaging Details : paper tray with out carton
Pitch : 2.0mm
wire range : AWG#26 - #30
Material : Phosphor
Finish : Tin-plated or Gold-flash
Category : Terminal
Insulation O.D : 1.30mm(Max)
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1, The specification of the product including basic size information, electrical and mechanical properties.


Basic size information
Termination Interface StyleCrimp or compression
Processing methodsE-stamping before tin-plated or Gold-flash
Insulation O.D.1.30mm(Max)
Part No.A2001-TPE or A2001-GPE
ApplicationSignal, PCB borad
Electrical properties
Current Rating2A AC, DC
Voltage Rating100V AC, DC
Contact Resistance10mΩ Max
Insulation Resistance1000MΩ min
Withstanding Voltage800V AC/minute
Mechanical properties
Temperature range-25℃ to 85 ℃
Other information please kindly check the following picture.

2 Mated Hosuing information

Product Profile
SeriesWire connector A2001H-NP & A2001HB-NP
CategoryWire to Board Crimp style Connectors
TypeDisconnectable type
Crimp style, Thin type
Specification
Pitch2.0 mm
Current rating2A AC,DC(AWG#26 to #30)
Voltage rating100V AC, DC
PC board
mounting direction
Top entry, Side entry

3, Related drawing and report


The following pictures are engineering drawing and testing report for your reference, wish these can help you to purchase the ideal and right parts from us. Thank you!




Testing report


1. Scope

This specification covers the requirements for product performance of 2.00mm pitch wire to board

connectors series.


2. Construction,Dimensions,Material & Plating

See the attached drawings


3. Ratings & Applicable Wires


ItemStandard
Rated Voltage (Max.)100V AC/DCInsulation O.D. 1.50mm (Max.)
Rated Current (Max.) And Applicable WiresAWG#242.0A AC/DC
AWG#261.5A AC/DC
AWG#281.0A AC/DC
AWG#300.5A AC/DC
Ambient Temperature Range-25℃ ~ +85℃*

*: Including terminal temperature rise


4. Electrical Performance


Test DescriptionProcedureRequirement
4-1

Contact Resistance


Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)10mΩ (Max.)
4-2Insulation ResistanceMate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)1000MΩ (Min.)
4-3Dielectric Withstanding VoltageMate connectors, apply 800V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301)No Breakdown.
4-4Contact Resistance on Crimped PortionCrimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA.5mΩ (Max.)

5. Mechanical Performance


Test DescriptionProcedureRequirement
5-1Actuator Insertion & Withdrawal ForceInsert and withdraw connectors at the speed rate of 25±3mm / minute.Refer to paragraph 7-2
5-2Crimping Pull Out ForceFix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)AWG#243.0kgf (Min)
AWG#262.0kgf (Min)
AWG#281.0kgf (Min)
AWG#300.8kgf (Min)
5-3Terminal Insertion Force.Insert the crimped terminal into the housing.1.00kgf (Max.)
5-4Terminal/Housing Retention Force.Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.1.50kgf (Min.)
5-5Pin Retention ForceApply axial push force at the speed rate of 25±3mm / minute1.00kgf (Min.)
5-6Latch Yield Strength

Mate connectors and pull apart until both latches break at the speed rate of

25±3mm / minute

3.00kgf (Min.)
5-7DurabilityWhen mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.Contact Resistance 20mΩ (Max.)
5-8Vibration

Amplitude: 1.5mm P-P

Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes.

(Based upon MIL-STD-202 Method 201A)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

Discontinuity 1 μsec.(Max.)

5-9Physical Shock490m/s²{50G},3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)


6. Environmental Performance And Others


Test DescriptionProcedureRequirement
6-1Temperature RiseCarrying rated current load.(Based upon UL 498)30℃(Max.)
6-2Heat Resistance85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

6-3Cold Resistance-25±3℃,96 hours (Based upon JIS C0020)
6-4Humidity

Temperature: 40±2℃

Relative Humidity : 90~95%

Duration: 96 hours

(Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

Insulation Resistance 100MΩ (Min.)

Dielectric Withstanding Voltage Must meet 4-3

6-5Temperature Cycling

5 cycles of:

a) -55℃ 30 minutes

b) +85℃ 30 minutes

(Based upon JIS C0025)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

6-6Salt SprayTin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
6-7SO2 Gas

24 hours exposure to 50±5ppm.

SO2 gas at 40±2℃.

6-8NH3 Gas40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
6-9Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes
6-10

Resistance to Soldering Heat

(DIP)

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.
6-11Resistance to Soldering Heat (SMT)

When reflowing

Refer to paragraph 8

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Crimp Specifications & Actuator Insertion/Withdrawal Force

7-1 Terminals with height, suggestion pressure width and wire and terminal's retention


Wire DiameterNumbersConductor Parts(Core Wire)mmInsulation Parts(PVC)mm
WidthHeightWidthHeight
AWG#24A20011.20±0.100.75±0.051.60(Max.)2.00(Max.)REF.
AWG#260.70±0.05
AWG#280.65±0.05
AWG#300.60±0.05

7-2 WITHOUT A LOCK [Unit : kgf]

CircuitsAt InitialCircuitsAt Initial
Insertion (Max.)Withdrawal (Min.)Insertion (Max.)Withdrawal (Min.)
Single0.700.10105.001.70
021.000.50115.501.70
031.500.65126.001.85
042.000.80136.002.00
052.500.95146.002.00
063.001.10156.002.00
073.501.25166.002.15
084.001.40176.002.15
094.501.55186.002.15

7-3 LOCK [Unit : kgf]

CircuitsAt InitialCircuitsAt Initial
Insertion (Max.)Withdrawal (Min.)Insertion (Max.)Withdrawal (Min.)
032.503.00106.004.50
043.003.00116.504.50
053.503.00127.004.50
064.003.00137.505.00
074.503.50148.005.00
085.004.00158.005.00
095.504.00168.005.50



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Crimp Terminal Connector

      

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2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals Images

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